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Title:
Silicon electronics on silk as a path to bioresorbable, implantable devices
Authors:
Kim, Dae-Hyeong; Kim, Yun-Soung; Amsden, Jason; Panilaitis, Bruce; Kaplan, David L.; Omenetto, Fiorenzo G.; Zakin, Mitchell R.; Rogers, John A.
Affiliation:
AA(Departments of Materials Science and Engineering, Beckman Institute and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, Illinois 61801, USA), AB(Departments of Materials Science and Engineering, Beckman Institute and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, Illinois 61801, USA), AC(Department of Biomedical Engineering, Tufts University, Medford, Massachusetts 02155, USA), AD(Department of Biomedical Engineering, Tufts University, Medford, Massachusetts 02155, USA), AE(Department of Biomedical Engineering, Tufts University, Medford, Massachusetts 02155, USA), AF(Department of Biomedical Engineering, Tufts University, Medford, Massachusetts 02155, USA), AG(Defense Advanced Research Projects Agency, 3701 North Fairfax Drive, Arlington Virginia 22203, USA), AH(Departments of Materials Science and Engineering, Beckman Institute and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, Illinois 61801, USA; Departments of Chemistry, Electrical and Computer Engineering, Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, Illinois 61801, USA)
Publication:
Applied Physics Letters, Volume 95, Issue 13, id. 133701 (3 pages) (2009). (ApPhL Homepage)
Publication Date:
09/2009
Origin:
AIP
Keywords:
bending, biomedical electronics, biomedical materials, biosensors, prosthetics, silicon, solubility
PACS Keywords:
Biosensors, Biomaterials
Abstract Copyright:
(c) 2009: American Institute of Physics
DOI:
10.1063/1.3238552
Bibliographic Code:
2009ApPhL..95m3701K

Abstract

Many existing and envisioned classes of implantable biomedical devices require high performance electronics/sensors. An approach that avoids some of the longer term challenges in biocompatibility involves a construction in which some parts or all of the system resorbs in the body over time. This paper describes strategies for integrating single crystalline silicon electronics, where the silicon is in the form of nanomembranes, onto water soluble and biocompatible silk substrates. Electrical, bending, water dissolution, and animal toxicity studies suggest that this approach might provide many opportunities for future biomedical devices and clinical applications.
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